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HomePage>>Services>>PCB Prototype
Prototype Turnkey Management


With experienced project management team and comprehensive prototype turnkey program, HAMP is committed to providing integrated turnkey solutions. Utilizing industry-leading engineering capability and leading-edge manufacturing technologies, we support our customer¡¯s time-to-market requirements with a focus on quality, service, flexibility and cost.

 

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PCB Prototypes
- Approved for all technologies
- ISO 9001:2000 and ISO 14001
- As quick as 24 hours (up to 12 layers)
- High density and high layer count
- High Aspect Ratio
- Laser drill
- Blind and Buried Vias
- Micro Vias
- Wide variety of Material Selection
- RoHS Compliant
PCB Capabilities
Attribute Standard Advanced Future
Minimum Outer Layer Line 0.004 0.003 0.002
Minimum Outer Layer Space 0.004 0.003 0.002
Minimum Inner Layer Line 0.004 0.003 0.002
Minimum Inner Layer Space 0.004 0.003 0.002
Minimum Outer Layer - Feature to Feature 0.005 0.004 0.003
Minimum Inner Layer - Feature to Feature 0.005 0.004 0.003
Minimum Space Conductor to Edge 0.025 0.02 0.015
Maximum Layer Count 30 40 50
Layer to layer Registration Tolerance +/- 0.005 +/- 0.004 +/- 0.003
Minimum Finished Thickness 0.02 0.01 0.008
Maximum Finished Thickness 0.24 0.3 0.35
Minimum Dielectric Thickness 0.0035 0.003 0.002
Minimum Impedance Tolerance -10% -7% -5%
Maximum Warp age Inch per inch 0.10% 0.70% 0.50%
Minimum Plated Hole Size - Finished 0.008 0.005 0.004
Hole Location Tolerance -0.004 -0.003 +/- 0.002
Maximum Aspect Ratio 8:01 10:01 14:01
Minimum Plane Relief over Drilled Hole 0.025 0.02 0.016
Minimum Inner Pad Size over Drilled Hole 0.012 0.01 0.008
Minimum Outer Pad Size over Drilled Hole 0.012 0.01 0.008
Plated Hole Tolerance -0.005 -0.003 +/- 0.001 - +/- 0.002
Minimum Solder Mask Web 0.005 0.004 0.003
Profiling Tolerances +/- 0.005 +/- 0.003 +/- 0.002
Minimum Feature Pitch - Grid Test 0.02 0.016 0.01
Minimum Feature Pitch - Flying Probe 0.015 0.01 0.008
Lead Time for PCB Prototype
Layers
Lead time(Natural Days which includes the weekends)
Minimum
Normal
2
1
5
4
2
5
6
3
7
8
3
7
10
5
10
12
6
10
14
8
10
16
8
10
18
8
10£¨11£©
20
10
14
22
10
14
24
10
14
26
10
14
28
10
14
30
10
14
Notes
The lead time may change based on diffirent technology requested and the board complexity.
 

Turnkey Assembly Service

- SMT ( Surface mount technology )- capable of producing printed circuit board assemblies and specializes in densely populated and through-hole, double sided with manually inserted components. FMi assures a quick turnaround in assembly and test.
- COS ( chip on flex or PCB )- Wire bonded chip on flex or board is offered, or in combination with SMT for precision packaging solutions to complex customer interconnect designs.
- FCOS (flip chip on substrate)- Flip chip on flex or board is offered, or in combination with SMT for precision packaging solutions to complex Customer interconnect designs.
- Thru Hole Applications- Dense multilayer double sided PCB and wave soldering application.
- Consignment & Turnkey Manufacturing
- Prototypes
- NPI (New Product Introduction)
- Production
- High volume production (offshore)
- Program Management
- Focused cross-functional teams
- Involvement from design stage
- Maintain Program status until completion
- Liaison to suppliers and customers
Turnkey PCB Assembly Capabilities

¡¤ BGA's and CCGA's
¡¤ Micro's and Fine Pitch BGAs
¡¤ Automated Surface Mount
¡¤ Chip on Board (COB)
¡¤ Through Hole Assemblies (THT)
¡¤ Mixed Technology Assemblies
¡¤ Surface Mount Technology (SMT)
¡¤ Functional Testing
¡¤ Box Build
¡¤ Press Fit Compliance Pin Connections
¡¤ X-Ray Inspection
¡¤ Automated Optical Inspection (AOI)
¡¤ Lead Free Soldering/Pb-Free
¡¤ Test Services, ICT, Functional, Burn-in
¡¤ Consign and Turnkey PCB assembly

 
 

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