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and a big design group of 60 people

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PCB Layout Design Service

CHIP Applications:

Mellanxo:Infiniscale IV

Cavium networks: CN36XX,CN38XX,CN50XX,CN52XX,CN53XX,CN56XX,CN58XX

RMI:XLR732,XLS108,XLS208,XLS408,XLS608,XLS416,XLS616,XLR300 series ,AU1300,AU1250 ---Demo board designed by HAMP

Broadcom:BCM56720,BCM56700,BCM56624,BCM56626,BCM56628,BCM56504,BCM56310,

BCM56314,BCM1255,BCM1250,BCM1125,BCM5464,BCM5482,BCM5691,BCM5670,BCM5690,

BCM5389,BCM5324,BCM5396

Cortina:CS1999,CS1777,IXF18105,IXF1110

Dune Networks: FAP10V,FAP20V,FAP21V,FE200

Marvell:98DX241,88E1145,98FX9110,98EX125

Xinlinx: Spartan 3,Virtes 4,Virtes5 LX30/LX50/LX110/LX330

Altera: EP1AGX50D,EP3SL110,EP1AGX60D,EP2S30

TI:C6415,C6416,C5561,DM642,C6417,C6446 Davinci series,ADS62C15

INTEL:2850,2800,2400,1200,425,82598,82546,82573,PXA255,PXA270,P945,P965,ATOM series

Freescale PowerPC: MPC8260,MPC850,MPC860,MPC750,MPC8270,MPC8272,MPC8247,MPC8245,

MPC8241,MPC8349,MPC8538,MPC8539,MPC8540,MPC8541,MPC7448,MPC5121E

Sigma Designs: SMP8654,SMP8652,SMP8640,SMP8630,SMP8634,EM8624L

galileo： GT－48304、GT－48350、GT－48520

Cicada Semiconductor: Cis8224、Cis8204、Cis8201

VITESSE:VSC7303、VSC7398、VSC7280、VSC8658

Sumsung： S3C2410 S3C2440,S3C2413、S3C6410

IDT:TSI109

ADI:TS201、AD9867 AD9772、AD9244、AD9779、AD80141

Conexant ：CX90028

AMCC:S19237、PPC405EZ 、PPC440

Aeluros：AEL2005 、AEL2006

Netlogicmicro：NL71024

Fulcrum Microsystems: FM2224 、FM3140、FM4112

National:ADC11C125

Design Capabilities

Up to 28 Layers
Up to 2.5GHz, 3.125GHz, 10 GHz Differential Pairs
Blind,Buried vias, Microvias and Via-in-Pad boards
Minimum BGA pin-pith: 0.5mm
Minimum line width ：3MIL
Minimum via hole size ：8mil (4mil Laser drill)
DDR/DDRII 800M/QDR/SRAM memory interface
Switch Power Supply
PCI, CPCI, PCI-X, PCI-Express, SATA, SATA II, XAUI, ATCA, AMC, HyperTransport
High speed high density large digital boards
Backplane
Probe card
Analog, Mixed Signals and RF Design
Embedded Capacitance and Embedded Resistance
RigidPCB, Flexible PCB and Rigid-Flex PCB

Team Based PCB Design---HAMP's partitioning technology enables multiple designers to simultaneously work on the same PCB layout design.

Team-based PCB Design
Partitioning technology
Effective use of layout resource
Concurrent & collaborative capability
Benefits
- True 24/7 operation
- 100% Manual Routing
- Reduce design cycle time
- Minimize layer count
- Cost savings
- Flexibility

Software Platforms

Layout Tools
- Cadence Allegro
- Mentor Expedition&boardstation
- PADS PowerPCB
Gerber Tools
- AutoCAD/CAM350/Valor
Schematic Capture
- OrCAD / ConceptHDL/ Protel99SE/ Powerlogic

Quote Package Requirement

Schematic or equivelent netlist
Bill of Materials
Mechanical Board Outline
Suggested Component Placement
Preliminary Layout Instructions* (SOW with Electrical Constraints)
Product Requirements* (Certifications, Standards, etc.)
Design Guidelines
Component footprint datasheet · Deliverable Items Required
Schedule Needs

Standard Deliverables

Database
Gerber File
Manufacturing Files
Custom deliverables available upon request

DFX Considerations

DFM: Design For Manufacture
DFA: Design For Assembly
DFT：Design For Test
DFR：Design For Reliability
DFC：DESIGN FOR COST

Call us: +86-755-86185506 Cell:+86-138-27439480 Email:support@hamppcb.com
Skype:star_hamp MSN:cjcn1011@hotmail.com GoogleTalk:cjcn1011@gmail.com

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