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Four branches in Beijing, Shenzhen, Shanghai and Hangzhou,
and a big design group of 60 people


HAMP-Leading PCB design service bureau in China
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Services
 
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PCB Layout Design Service
CHIP Applications:
Mellanxo:Infiniscale IV
Cavium networks: CN36XX,CN38XX,CN50XX,CN52XX,CN53XX,CN56XX,CN58XX
RMI:XLR732,XLS108,XLS208,XLS408,XLS608,XLS416,XLS616,XLR300 series ,AU1300,AU1250 ---Demo board designed by HAMP
Broadcom:BCM56720,BCM56700,BCM56624,BCM56626,BCM56628,BCM56504,BCM56310,
BCM56314,BCM1255,BCM1250,BCM1125,BCM5464,BCM5482,BCM5691,BCM5670,BCM5690,
BCM5389,BCM5324,BCM5396
Cortina:CS1999,CS1777,IXF18105,IXF1110
Dune Networks: FAP10V,FAP20V,FAP21V,FE200
Marvell:98DX241,88E1145,98FX9110,98EX125
Xinlinx: Spartan 3,Virtes 4,Virtes5 LX30/LX50/LX110/LX330
Altera: EP1AGX50D,EP3SL110,EP1AGX60D,EP2S30
TI:C6415,C6416,C5561,DM642,C6417,C6446 Davinci series,ADS62C15
INTEL:2850,2800,2400,1200,425,82598,82546,82573,PXA255,PXA270,P945,P965,ATOM series
Freescale PowerPC: MPC8260,MPC850,MPC860,MPC750,MPC8270,MPC8272,MPC8247,MPC8245,
MPC8241,MPC8349,MPC8538,MPC8539,MPC8540,MPC8541,MPC7448,MPC5121E
Sigma Designs: SMP8654,SMP8652,SMP8640,SMP8630,SMP8634,EM8624L
galileo£º GT£­48304¡¢GT£­48350¡¢GT£­48520
Cicada Semiconductor: Cis8224¡¢Cis8204¡¢Cis8201
VITESSE:VSC7303¡¢VSC7398¡¢VSC7280¡¢VSC8658
Sumsung£º S3C2410 S3C2440,S3C2413¡¢S3C6410
IDT:TSI109
ADI:TS201¡¢AD9867 AD9772¡¢AD9244¡¢AD9779¡¢AD80141
Conexant £ºCX90028
AMCC:S19237¡¢PPC405EZ ¡¢PPC440
Aeluros£ºAEL2005 ¡¢AEL2006
Netlogicmicro£ºNL71024
Fulcrum Microsystems: FM2224 ¡¢FM3140¡¢FM4112
National:ADC11C125

Design Capabilities
  • Up to 28 Layers
  • Up to 2.5GHz, 3.125GHz, 10 GHz Differential Pairs
  • Blind,Buried vias, Microvias and Via-in-Pad boards
  • Minimum BGA pin-pith: 0.5mm
  • Minimum line width £º3MIL
  • Minimum via hole size £º8mil (4mil Laser drill)
  • DDR/DDRII 800M/QDR/SRAM memory interface
  • Switch Power Supply
  • PCI, CPCI, PCI-X, PCI-Express, SATA, SATA II, XAUI, ATCA, AMC, HyperTransport
  • High speed high density large digital boards
  • Backplane
  • Probe card
  • Analog, Mixed Signals and RF Design
  • Embedded Capacitance and Embedded Resistance
  • RigidPCB, Flexible PCB and Rigid-Flex PCB

Team Based PCB Design---HAMP's partitioning technology enables multiple designers to simultaneously work on the same PCB layout design.

  • Team-based PCB Design
  • Partitioning technology
  • Effective use of layout resource
  • Concurrent & collaborative capability
  • Benefits
    - True 24/7 operation
    - 100% Manual Routing
    - Reduce design cycle time
    - Minimize layer count
    - Cost savings
    - Flexibility
Software Platforms
  • Layout Tools
    - Cadence Allegro
    - Mentor Expedition&boardstation
    - PADS PowerPCB
  • Gerber Tools
    - AutoCAD/CAM350/Valor
  • Schematic Capture
    - OrCAD / ConceptHDL/ Protel99SE/ Powerlogic
Quote Package Requirement
  • Schematic or equivelent netlist
  • Bill of Materials
  • Mechanical Board Outline
  • Suggested Component Placement
  • Preliminary Layout Instructions* (SOW with Electrical Constraints)
  • Product Requirements* (Certifications, Standards, etc.)
  • Design Guidelines
  • Component footprint datasheet ¡€ Deliverable Items Required
  • Schedule Needs
Standard Deliverables
  • Database
  • Gerber File
  • Manufacturing Files
  • Custom deliverables available upon request
DFX Considerations
  • DFM: Design For Manufacture
  • DFA: Design For Assembly
  • DFT£ºDesign For Test
  • DFR£ºDesign For Reliability
  • DFC£ºDESIGN FOR COST

 


Call us: +86-755-86185506 Cell:+86-138-27439480 Email:support@hamppcb.com
Skype:star_hamp MSN:cjcn1011@hotmail.com GoogleTalk:cjcn1011@gmail.com

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