 PCB
Layout Design Service |
| Design Capabilities |
- Up to 28 Layers
- Up to 2.5GHz, 3.125GHz, 10 GHz Differential Pairs
- Blind,Buried vias, Microvias and Via-in-Pad boards
- Minimum BGA pin-pith: 0.5mm
- Minimum line width £º3MIL
- Minimum via hole size £º8mil (4mil Laser drill)
- DDR/DDRII 800M/QDR/SRAM memory interface
- Switch Power Supply
- PCI, CPCI, PCI-X, PCI-Express, SATA, SATA II, XAUI, ATCA, AMC, HyperTransport
- High speed high density large digital boards
- Backplane
- Probe card
- Analog, Mixed Signals and RF Design
- Embedded Capacitance and Embedded Resistance
- RigidPCB, Flexible PCB and Rigid-Flex PCB
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Team Based PCB Design---HAMP's partitioning technology enables multiple designers
to simultaneously work on the same PCB layout design.
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- Team-based PCB Design
- Partitioning technology
- Effective use of layout resource
- Concurrent & collaborative capability
- Benefits
- True 24/7 operation
- 100% Manual Routing
- Reduce design cycle time
- Minimize layer count
- Cost savings
- Flexibility
|
| Software Platforms |
- Layout Tools
- Cadence Allegro
- Mentor Expedition&boardstation
- PADS PowerPCB
- Gerber Tools
- AutoCAD/CAM350/Valor
- Schematic Capture
- OrCAD / ConceptHDL/ Protel99SE/ Powerlogic
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| Quote Package Requirement |
- Schematic or equivelent netlist
- Bill of Materials
- Mechanical Board Outline
- Suggested Component Placement
- Preliminary Layout Instructions* (SOW with Electrical Constraints)
- Product Requirements* (Certifications, Standards, etc.)
- Design Guidelines
- Component footprint datasheet ¡¤ Deliverable Items Required
- Schedule Needs
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| Standard Deliverables |
- Database
- Gerber File
- Manufacturing Files
- Custom deliverables available upon request
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| DFX Considerations |
- DFM: Design For Manufacture
- DFA: Design For Assembly
- DFT£ºDesign For Test
- DFR£ºDesign For Reliability
- DFC£ºDESIGN FOR COST
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