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Four branches in Beijing, Shenzhen, Shanghai and Hangzhou,
and a big design group of 60 people


HAMP-Leading PCB design service bureau in China
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PCB Fabrication

Fast Delivery
We routinely deliver 2, 4 and 6 layer boards in 5 days from our facilities in China.

Competitive Advantage
When price counts, HAMP provides the best pricing possible. Our operations are coordinated by local managers who read, write and speak English language and understand the customer's needs.

Consistent Quality
Our facilities maintain the highest levels of certification and are equipped with the latest, industry leading technology to ensure quality in every run.

PCB Fabrication Capabilities

Up to 30 Layers
Min. Trace/Space .003/.003
Max. Panel Size 23" x 35"
Finishes: Lead Free HASL, OSP, Hard & soft Gold, Immersion Silver, Immersion Tin
PCB Materials: FR4, High Tg FR4, Polyimide, Halogen Free, Rogers, Arlon, Teconic, PTFE, Isola
20:1 Aspect Ratio
Min. Hole size. .006
ISO 9001, UL, ISO 14000, IPC-A-600F, ISO/TSI16949 SGS Compliance

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Attribute Standard Advanced Future
Minimum Outer Layer Line 0.004 0.003 0.002
Minimum Outer Layer Space 0.004 0.003 0.002
Minimum Inner Layer Line 0.004 0.003 0.002
Minimum Inner Layer Space 0.004 0.003 0.002
Minimum Outer Layer - Feature to Feature 0.005 0.004 0.003
Minimum Inner Layer - Feature to Feature 0.005 0.004 0.003
Minimum Space Conductor to Edge 0.025 0.02 0.015
Maximum Layer Count 30 40 50
Layer to layer Registration Tolerance +/- 0.005 +/- 0.004 +/- 0.003
Minimum Finished Thickness 0.02 0.01 0.008
Maximum Finished Thickness 0.24 0.3 0.35
Minimum Dielectric Thickness 0.0035 0.003 0.002
Minimum Impedance Tolerance -10% -7% -5%
Maximum Warp age Inch per inch 0.10% 0.70% 0.50%
Minimum Plated Hole Size - Finished 0.008 0.005 0.004
Hole Location Tolerance -0.004 -0.003 +/- 0.002
Maximum Aspect Ratio 8:01 10:01 14:01
Minimum Plane Relief over Drilled Hole 0.025 0.02 0.016
Minimum Inner Pad Size over Drilled Hole 0.012 0.01 0.008
Minimum Outer Pad Size over Drilled Hole 0.012 0.01 0.008
Plated Hole Tolerance -0.005 -0.003 +/- 0.001 - +/- 0.002
Minimum Solder Mask Web 0.005 0.004 0.003
Profiling Tolerances +/- 0.005 +/- 0.003 +/- 0.002
Minimum Feature Pitch - Grid Test 0.02 0.016 0.01
Minimum Feature Pitch - Flying Probe 0.015 0.01 0.008

 

 
 
 

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