hamppcb.com LOGO

Four branches in Beijing, Shenzhen, Shanghai and Hangzhou,
and a big design group of 60 people


HAMP-Leading PCB design service bureau in China
setHomePage
addFavorite
english
chinese
Hamp homepage company news service example evaluate job contact us
Services
 
 
HomePage>>Services>>Services advantage
Design Fields and Design Abilities
Service Fields

Data Communication Series: VOIP¡¢xDSL, router, Ethernet exchanger, access to server
Light Network Products: SDH, DWDM, METRO
Wireless Products: GSM/GPRS, CDMA, WCDMA, wireless AP equipment
Multimedia Products: Video telephone, conference TV
Computer Products: High-end server mainboard
Consumer Electronics: MP3 / Digital Camera

We first put forward the high speed PCB design methodology and deign conception called as Constraint-Based High Speed PCB Design Methodology, which formed the perfect design flow and design method, which, combined with such design high speed PCB design means as signal integrity (SI) analysis, EMC/EMI countermeasure analysis, power integrity (PI) and so on, has been applied to the design of thousands of single boards, which, comparing with the design method before, has obvious improvement and upgrading in design quality, design efficiency, cost and technology, so that one design is correct and the high speed PCB design level can keep pace with the international one.

Design Capabilities

¡¤Max. Design Layers: 28 ¡¤Max. PINs: 40,000
¡¤Max. Connections: 30,000 ¡¤Min. VIA: 8MIL
¡¤ Min. Trace Width: 3ML ¡¤Min. Trace Spacing: 4MIL
¡¤Max. BGA on one PCB board: 48 ¡¤Min. BGA PIN pitch: 0.8mm
¡¤Fastest Signal: 3.125G differential signal ¡¤Max. BGA PINs: 1,428
¡¤Max. Chip Core Frequency: Dual Core frequency, 800MHz
PMC/CPCI Platform High Density Single Board: PCI backboard, system board, peripheral board, high-speed backboard
High-speed design backup technology
Pre-Post Layout SI Analysis
Timing Analysis
Plate EMC/EMI Countermeasures and Implementation
£¨PI£©Power Supply Plane Integrity
Design Methodology: Constraint-Based High speed PCB design methodology , FLOORPLAN design method
High-density design backup technology
HDI£ºHigh Density Interconnect
FPC: High Density Interconnect (laser drill design, design aperture<=6mil)
FPC: Flexible Power Circuit
Buried Capacitor
Buried Via
Blind Via
DFX: DESIGN FOR X
DFM£ºDESIGN FOR MANUFACTURE
DFA£ºDESIGN FOR ASSEMBLY
DFT£ºDESIGN FOR TEST
DFC£ºDESIGN FOR COST(The design for the cost the customer: Take cost and quality into consideration)
PCB Design Tools
¡ñ CADENCE ALLEGRO ¡ñ MENTOR BoardStation ¡ñ Mentor Expedition ¡ñ POWERPCB 5.0 ¡ñ PROTEL 99SE

 

Call us: +86-755-86185506 Cell:+86-138-27439480 Email:support@hamppcb.com
Skype:star_hamp MSN:cjcn1011@hotmail.com GoogleTalk:cjcn1011@gmail.com

Copyright © 2003-2006 HAMPPCB Design. All rights reserved. POWER BY LOVE INTERNET