Service Fields
Data Communication Series: VOIP¡¢xDSL, router, Ethernet
exchanger, access to server
Light Network Products: SDH, DWDM, METRO
Wireless Products: GSM/GPRS, CDMA, WCDMA, wireless
AP equipment
Multimedia Products: Video telephone, conference
TV
Computer Products: High-end server mainboard
Consumer Electronics: MP3 / Digital Camera |
 |
We first put forward the high
speed PCB design methodology and deign conception called
as Constraint-Based High Speed PCB Design Methodology,
which formed the perfect design flow and design method,
which, combined with such design high speed PCB design
means as signal integrity (SI) analysis, EMC/EMI countermeasure
analysis, power integrity (PI) and so on, has been applied
to the design of thousands of single boards, which,
comparing with the design method before, has obvious
improvement and upgrading in design quality, design
efficiency, cost and technology, so that one design
is correct and the high speed PCB design level can keep
pace with the international one.
Design
Capabilities
| ¡¤Max. Design
Layers: 28 |
¡¤Max. PINs:
40,000 |
| ¡¤Max. Connections: 30,000 |
¡¤Min. VIA: 8MIL |
| ¡¤ Min. Trace Width: 3ML
|
¡¤Min. Trace Spacing: 4MIL |
| ¡¤Max. BGA on one PCB board: 48 |
¡¤Min. BGA PIN pitch: 0.8mm |
| ¡¤Fastest Signal: 3.125G
differential signal |
¡¤Max. BGA PINs: 1,428 |
| ¡¤Max. Chip Core Frequency: Dual Core frequency,
800MHz |
|
PMC/CPCI
Platform High Density Single Board: PCI backboard, system
board, peripheral board, high-speed backboard
High-speed design backup technology
Pre-Post Layout SI Analysis
Timing Analysis
Plate EMC/EMI Countermeasures and Implementation
£¨PI£©Power Supply Plane Integrity
Design Methodology: Constraint-Based High speed PCB design
methodology , FLOORPLAN design method
High-density design backup technology
HDI£ºHigh Density Interconnect
FPC: High Density Interconnect (laser drill design, design
aperture<=6mil)
FPC: Flexible Power Circuit
Buried Capacitor
Buried Via
Blind Via
DFX: DESIGN FOR X
DFM£ºDESIGN FOR MANUFACTURE
DFA£ºDESIGN FOR ASSEMBLY
DFT£ºDESIGN FOR TEST
DFC£ºDESIGN FOR COST(The design for the cost the customer:
Take cost and quality into consideration)
PCB Design Tools
¡ñ CADENCE ALLEGRO ¡ñ MENTOR BoardStation ¡ñ Mentor Expedition
¡ñ POWERPCB 5.0 ¡ñ PROTEL 99SE |