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| 首页>>服务领域>>高速PCB设计 |
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Design Capabilities
- Highest layer count ：28
- High speed large digital boards
- High density digital boards
- Backplane
- Probe card
- Chip on board
- Motherboard
- High-end computing
- IPC(Industrial Personnal Computer) board
- Telecommunication boards
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- Blind,Buried vias, Microvias and Via-in-Pad boards
- Minimum BGA pin-pith: 0.5mm
- Highest signal speed : 10 GHz differential signal
- Minimum line width ：3MIL
- Minimum via hole size ：8mil (4mil Laser drill)
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| Important Chips
- Intel2850、intel2800、intel 2400、intel 1200 intel425 intel255
intel270 intel270a
- 英特尔服务器平台Bensley，以及Dempesy和Woodcrest两大系列双核处理器
- 基于Intel 5000V芯片组的GA-7VCSV和基于Intel 5000P芯片组的GA-7BESH
- INTEL芯片组：810 815 845 865 915 945
- Freescale的PowerPC系列：MPC8260、MPC850、MPC750、MPC8272、MPC8247、MPC8245、MPC860、
MPC8241、MPC8240、mpc8539,mpc8538,mpc8540,mpc8541、MPC7448 mpc7xxxx
- Freescale的ColdFire MCF5XXX系列（如MCF5206E）
- RMI RevA,RevB, RevC and RevD---Demo board designed by HAMPPCB
- IDT的Interprise? PCI系列（如：79RC32332）
- galileo： GT－48304、GT－48350、GT－48520等
- Broadcom 1255 1250 1125 5464、5691、5670、5690、5421
- Xilinx: Virtex II，Virtex Pro Virtex-5，Virtex-4，Spartan-3，Virtex-II+Pro
- Altera:Cyclone II ,Stratix II GX ,Stratix III 都做过
- TI: C6415 C6416 C5561 DM642
TMS320DMXXX, DaVinci
C6446芯片等系列DSP处理器
- Marvell:98DX241、88E1145、98FX9110、98EX125
- pericom： PI7C7300等
- Freescale PowerPC processor and Freescale 32 bit ColdFire processor
- national： dp83815等
- Cicada Semiconductor:Cis8224、Cis8204、Cis8201
- VITESSE:VSC7303
- 三星Sumsung s3c2410 s3c2440,s3c2413
- AMCC Chips
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Design Expertise
- DDR/DDRII 800M/QDR/SRAM memory interface
- Switch Power Supply
- PCI, CPCI, PCI-X, PCIE, SATA, SATA II, XAUI
- ATCA, AMC, HyperTransport
- TI DLP-RAMBUS RDRAM
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DFX Consideratios
- DFM: Design For Manufacture
- DFA: Design For Assembly
- DFT：Design For Test
- DFR：Design For Reliability
- DFC：DESIGN FOR COST
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